008 |
|
091201s2010 mau s j eng d |
020 |
|
|a9781441909831 (paper)
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020 |
|
|a9781441909848 (electronic bk.)
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090 |
|
|aTK7874|b.R111 2010
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245 |
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|aRF and Microwave Microelectronics Packaging|h[electronic resource] /|cedited by Ken Kuang, Franklin Kim, Sean S. Cahill.
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260 |
|
|aBoston, MA :|bSpringer Science+Business Media, LLC,|c2010.
|
300 |
|
|axiv, 284 p. :|bill., digital ;|c24 cm.
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440 |
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|aSpringer eBooks
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650 |
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|aMicroelectronic packaging.
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650 |
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|aEngineering
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24
|
|aCircuits and Systems
|
650 |
24
|
|aElectronics and Microelectronics, Instrumentation
|
650 |
24
|
|aMicrowaves, RF and Optical Engineering
|
700 |
1
|
|aCahill, Sean S.
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700 |
1
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|aKim, Franklin.
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700 |
1
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|aKuang, Ken.
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710 |
2
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|aSpringerLink (Online service)
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773 |
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|tSpringer eBooks
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809 |
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|pEB|dTK7874|eR111|y2010
|
856 |
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|
|uhttp://dx.doi.org/10.1007/978-1-4419-0984-8
|
950 |
|
|aEngineering (Springer-11647)
|