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20210625132652.0 |
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|a 2010287045
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|a9780071476232
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|a9780071642651
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|aDLC|cDLC|dDLC|dNOU
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|aeng
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050 |
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|aTK7836|b.H366 2010
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082 |
04
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|a621.381|222
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100 |
1
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|aHarman, George G.
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245 |
10
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|aWire Bonding in Microelectronics, Third Edition|h[electronic resource]/|cGeorge G. Harmon.
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250 |
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|a3rd ed.
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260 |
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|aNew York :|bMcGraw-Hill,|cc2010.
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300 |
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|axx, 426 p. :|bill. microelectronics. 1989.
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440 |
0
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|amcgraw-hill e-book
|
650 |
0
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|aElectronic packaging|xDefects.
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650 |
0
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|aElectronic packaging|xReliability.
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650 |
0
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|aSemiconductors|xFailures.
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650 |
0
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|aWire bonding (Electronic packaging)|xProduction control.
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655 |
7
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|aElectronic books.|2local.
|
700 |
1
|
|aHarman, George G.|tReliability and yield problems of wire bonding in microelectronics.
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809 |
|
|pEB|dTK7836|eH287|y2010
|
856 |
40
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|uhttps://lb30.libraryandbook.net/Book_detial/EB978007147623201|zClick for full text (McGrawHill)
|