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020 |
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|a0071626239
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|a9780071626231
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|a9789780071622
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|aDLC|cDLC|dYDX|dBWX|dOKU|dDLC|dNOU
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|aTK7875|b.A378 2010
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|a621.381/046|222
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245 |
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|aAdvanced MEMS Packaging|h[electronic resource]/|cJohn H. Lau ... [et al.].
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246 |
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|aAdvanced microelectromechanical systems packaging.
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260 |
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|aNew York :|bMcGraw-Hill,|cc2010.
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300 |
|
|axxiii, 552 p. :|bill.
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440 |
0
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|amcgraw-hill e-book
|
505 |
0
|
|aEnabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
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650 |
0
|
|aMicroelectromechanical systems.
|
650 |
0
|
|aMicroelectronic packaging.
|
655 |
7
|
|aElectronic books.|2local.
|
700 |
1
|
|aLau, John H.
|
809 |
|
|pEB|dTK7875|eA244|y2010
|
856 |
40
|
|uhttps://lb30.libraryandbook.net/Book_detial/EB978007162623101|zClick for full text (McGrawHill)
|